MT55L256V18P1B-6 vs AS7C251MNTD18A-200TQI feature comparison

MT55L256V18P1B-6 Micron Technology Inc

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AS7C251MNTD18A-200TQI Integrated Silicon Solution Inc

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA QFP
Package Description 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119 LQFP,
Pin Count 119 100
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 7.5 ns
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e0 e0
Length 22 mm 20 mm
Memory Density 4718592 bit 18874368 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 262144 words 1048576 words
Number of Words Code 256000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18 1MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Power Supplies 2.5,3.3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.6 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.5 mA
Supply Voltage-Max (Vsup) 3.465 V 2.65 V
Supply Voltage-Min (Vsup) 3.135 V 2.35 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 2 2
Pbfree Code No
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE

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