MT55L256V18P1B-6 vs MT55L128L36F1B-10 feature comparison

MT55L256V18P1B-6 Cypress Semiconductor

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MT55L128L36F1B-10 Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 119 119
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 7.5 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish NOT APPLICABLE NOT APPLICABLE
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 2 2