MT58L128L36F1B-6.8 vs MT58L128L36F1B-6.8IT feature comparison

MT58L128L36F1B-6.8 Micron Technology Inc

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MT58L128L36F1B-6.8IT Micron Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119
Pin Count 119 119
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6.8 ns 6.8 ns
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50 BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Standby Current-Max 0.01 A 0.01 A
Standby Voltage-Min 3.14 V 3.14 V
Supply Current-Max 0.425 mA 0.425 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 1

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