MT8971BP
vs
MT9172ANR
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
MICROSEMI CORP
|
Package Description |
PLASTIC, LCC-28
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Data Rate |
160 Mbps
|
160 Mbps
|
ISDN Access Rate |
BASIC
|
BASIC
|
JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G24
|
JESD-609 Code |
e0
|
|
Length |
11.5062 mm
|
|
Number of Functions |
1
|
|
Number of Terminals |
28
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output High Voltage-Min |
2.4 V
|
2.4 V
|
Output Low Current-Max |
0.005 A
|
0.005 A
|
Output Low Voltage-Max |
0.4 V
|
0.4 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
SSOP
|
Package Equivalence Code |
LDCC28,.5SQ
|
SSOP24,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Point |
S
|
S
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
DIGITAL SLIC
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.5062 mm
|
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
SSOP
|
Pin Count |
|
24
|
|
|
|
Compare MT8971BP with alternatives