MT8976AP1
vs
DS2153Q
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
LEAD FREE, PLASTIC, MS-018AC, LCC-44
|
0.652 INCH, PLASTIC, LCC-44
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
e0
|
| Length |
16.585 mm
|
16.585 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.572 mm
|
| Supply Current-Max |
10 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
16.585 mm
|
16.585 mm
|
| Base Number Matches |
1
|
14
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
44
|
| Carrier Type |
|
CEPT PCM-30/E-1
|
| Package Equivalence Code |
|
LDCC44,.7SQ
|
|
|
|
Compare MT8976AP1 with alternatives
Compare DS2153Q with alternatives