MT8977AE1 vs MT8979AC feature comparison

MT8977AE1 Microsemi Corporation

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MT8979AC Microsemi Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MITEL SEMICONDUCTOR
Part Package Code DIP DIP
Package Description DIP, DIP-28
Pin Count 28 28
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T28 R-CDIP-T28
JESD-609 Code e3 e0
Length 37.4 mm 36.83 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.35 mm 6.35 mm
Supply Current-Max 10 mA 15 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 10.16 mm
Base Number Matches 1 1
Carrier Type CEPT PCM-30/E-1
Package Equivalence Code DIP28,.6

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