MT9172AN1
vs
MT8971BE
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
ZARLINK SEMICONDUCTOR INC
|
| Part Package Code |
SSOP
|
|
| Package Description |
5.30 MM WIDTH, LEAD FREE, MO-150AG, SSOP-24
|
DIP, DIP22,.4
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDIP-T22
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.2 mm
|
27.559 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
22
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
5.33 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
DIGITAL SLIC
|
DIGITAL SLIC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
10.16 mm
|
| Base Number Matches |
3
|
2
|
| Data Rate |
|
160 Mbps
|
| ISDN Access Rate |
|
BASIC
|
| Output High Voltage-Min |
|
2.4 V
|
| Output Low Current-Max |
|
0.005 A
|
| Output Low Voltage-Max |
|
0.4 V
|
| Package Equivalence Code |
|
DIP22,.4
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Reference Point |
|
S
|
|
|
|
Compare MT9172AN1 with alternatives
Compare MT8971BE with alternatives