MTD10N05E
vs
MTD1N40-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA INC
|
| Package Description |
SMALL OUTLINE, R-PSSO-G2
|
IN-LINE, R-PSIP-T3
|
| Reach Compliance Code |
unknown
|
unknown
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
Single
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
50 V
|
400 V
|
| Drain Current-Max (Abs) (ID) |
10 A
|
|
| Drain Current-Max (ID) |
10 A
|
1 A
|
| Drain-source On Resistance-Max |
0.1 Ω
|
5 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
100 pF
|
10 pF
|
| JEDEC-95 Code |
TO-252
|
TO-251
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSIP-T3
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation Ambient-Max |
20 W
|
20 W
|
| Power Dissipation-Max (Abs) |
20 W
|
20 W
|
| Pulsed Drain Current-Max (IDM) |
24 A
|
3 A
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Max (toff) |
80 ns
|
65 ns
|
| Turn-on Time-Max (ton) |
120 ns
|
35 ns
|
| Base Number Matches |
3
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.29.00.95
|
|
|
|
Compare MTD10N05E with alternatives
Compare MTD1N40-1 with alternatives