MTP25N10E
vs
NTP52N10
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ON SEMICONDUCTOR
|
| Package Description |
,
|
FLANGE MOUNT, R-PSFM-T3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Configuration |
Single
|
SINGLE WITH BUILT-IN DIODE
|
| Drain Current-Max (Abs) (ID) |
25 A
|
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
150 W
|
178 W
|
| Surface Mount |
NO
|
NO
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
TO-220AB
|
| Pin Count |
|
3
|
| Manufacturer Package Code |
|
CASE 221A-09
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.29.00.95
|
| Samacsys Manufacturer |
|
onsemi
|
| Avalanche Energy Rating (Eas) |
|
800 mJ
|
| Case Connection |
|
DRAIN
|
| DS Breakdown Voltage-Min |
|
100 V
|
| Drain Current-Max (ID) |
|
60 A
|
| Drain-source On Resistance-Max |
|
0.03 Ω
|
| JEDEC-95 Code |
|
TO-220AB
|
| JESD-30 Code |
|
R-PSFM-T3
|
| JESD-609 Code |
|
e0
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Pulsed Drain Current-Max (IDM) |
|
156 A
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Tin/Lead (Sn80Pb20)
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare NTP52N10 with alternatives