MUN5235DW1T1
vs
MUN5235DW1T1
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
ONSEMI
|
Package Description |
SMALL OUTLINE, R-PDSO-G6
|
CASE 419B-02, SC-88, 6 PIN
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.21.00.95
|
|
Additional Feature |
BUILT IN BIAS RESISTOR RATIO IS 21.3636
|
BUILT IN BIAS RESISTOR RATIO IS 21.36
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
50 V
|
50 V
|
Configuration |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
DC Current Gain-Min (hFE) |
80
|
80
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
2
|
2
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation Ambient-Max |
0.15 W
|
|
Power Dissipation-Max (Abs) |
0.15 W
|
0.15 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Element Material |
SILICON
|
SILICON
|
VCEsat-Max |
0.25 V
|
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
No
|
Part Package Code |
|
SC-88
|
Pin Count |
|
6
|
Manufacturer Package Code |
|
CASE 419B-02
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
onsemi
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
235
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transistor Application |
|
SWITCHING
|
|
|
|
Compare MUN5235DW1T1 with alternatives
Compare MUN5235DW1T1 with alternatives