MX0912B251Y,114 vs MS2393 feature comparison

MX0912B251Y,114 NXP Semiconductors

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MS2393 Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Part Package Code DFM
Package Description METAL CERAMIC PACKAGE-2 0.400 X 0.400 INCH, HERMETIC SEALED, METAL CERAMIC, M138, 2 PIN
Pin Count 2 2
Manufacturer Package Code SOT439A
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75
Additional Feature DIFFUSED EMITTER BALLASTING RESISTORS WITH EMITTER BALLASTING RESISTORS
Case Connection BASE BASE
Collector-Emitter Voltage-Max 20 V
Configuration SINGLE SINGLE
Highest Frequency Band L BAND L BAND
JESD-30 Code R-CDFM-F2 S-CDFM-F2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR SQUARE
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Collector Current-Max (IC) 11 A
DC Current Gain-Min (hFE) 5
JESD-609 Code e0
Terminal Finish TIN LEAD

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