MX0912B251Y,114 vs MRF10150 feature comparison

MX0912B251Y,114 NXP Semiconductors

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MRF10150 TE Connectivity

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS TE CONNECTIVITY LTD
Part Package Code DFM
Package Description METAL CERAMIC PACKAGE-2 ,
Pin Count 2 2
Manufacturer Package Code SOT439A CASE 376B-02
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75
Additional Feature DIFFUSED EMITTER BALLASTING RESISTORS
Case Connection BASE
Collector-Emitter Voltage-Max 20 V
Configuration SINGLE SINGLE
Highest Frequency Band L BAND
JESD-30 Code R-CDFM-F2
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 200 °C 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified
Surface Mount YES
Terminal Form FLAT
Terminal Position DUAL
Transistor Application AMPLIFIER
Transistor Element Material SILICON
Base Number Matches 1 4
Rohs Code Yes
Collector Current-Max (IC) 14 A
DC Current Gain-Min (hFE) 20
Power Dissipation-Max (Abs) 700 W

Compare MX0912B251Y,114 with alternatives

Compare MRF10150 with alternatives