N74F153D vs 54F153/BFAJC feature comparison

N74F153D NXP Semiconductors

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54F153/BFAJC Motorola Mobility LLC

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC DFP
Package Description 3.90 MM, PLASTIC, MS-012AC, SOT109-1, SOP-16 DFP, FL16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDSO-G16 R-GDFP-F16
JESD-609 Code e4 e0
Length 9.9 mm 9.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.02 A 0.02 A
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DFP
Package Equivalence Code SOP16,.25 FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE FLATPACK
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 20 mA 20 mA
Prop. Delay@Nom-Sup 12 ns 14 ns
Propagation Delay (tpd) 8 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.15 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 6.415 mm
Base Number Matches 4 1
Screening Level 38535Q/M;38534H;883B

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