N74F153D vs 54F153DMQB feature comparison

N74F153D NXP Semiconductors

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54F153DMQB National Semiconductor Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MS-012AC, SOT109-1, SOP-16 CERAMIC, DIP-16
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.02 A 0.02 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 20 mA 20 mA
Prop. Delay@Nom-Sup 12 ns 9 ns
Propagation Delay (tpd) 8 ns 9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 4 1

Compare N74F153D with alternatives

Compare 54F153DMQB with alternatives