N74F74D623 vs MM74HC74AMTCX feature comparison

N74F74D,623 NXP Semiconductors

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MM74HC74AMTCX

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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description PLASTIC, SOT108-1, SO-14
Pin Count 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family F/FAST
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 1
Number of Functions 2
Number of Terminals 14
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 16 mA
Propagation Delay (tpd) 9.2 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology TTL
Temperature Grade COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE
Width 3.9 mm
fmax-Min 100 MHz
Base Number Matches 1

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