N74LVC02APWDH vs 74LVC02PW feature comparison

N74LVC02APWDH NXP Semiconductors

Buy Now Datasheet

74LVC02PW Philips Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Package Description TSSOP, TSSOP, TSSOP14,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Width 4.4 mm
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.024 A
Package Equivalence Code TSSOP14,.25
Prop. Delay@Nom-Sup 6 ns
Schmitt Trigger NO
Terminal Finish Tin/Lead (Sn/Pb)

Compare N74LVC02APWDH with alternatives