N82503
vs
S82503
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Part Package Code |
LCC
|
QFP
|
Package Description |
PLASTIC, LCC-44
|
QFP-44
|
Pin Count |
44
|
44
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
Data Encoding/Decoding Method |
NRZ; BIPH-LEVEL (MANCHESTER)
|
NRZ; BIPH-LEVEL (MANCHESTER)
|
Data Transfer Rate-Max |
1.25 MBps
|
1.25 MBps
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-J44
|
S-PQFP-G44
|
JESD-609 Code |
e0
|
e0
|
Length |
16.6 mm
|
10 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
|
|
Number of I/O Lines |
|
|
Number of Serial I/Os |
3
|
3
|
Number of Terminals |
44
|
44
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
4.57 mm
|
2.35 mm
|
Supply Current-Max |
75 mA
|
75 mA
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
16.6 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
Base Number Matches |
1
|
1
|
|
|
|