NB7L1008MMNG
vs
NB7L1008MMNTWG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ON SEMICONDUCTOR
|
| Part Package Code |
QFN32, 5x5, 0.5P, 3.1x3.1EP
|
|
| Package Description |
QFN-32
|
|
| Pin Count |
32
|
|
| Manufacturer Package Code |
488AM
|
488AM
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Additional Feature |
ALSO OPERATES AT 3.3V
|
|
| Family |
7L
|
|
| Input Conditioning |
STANDARD
|
|
| JESD-30 Code |
S-XQCC-N32
|
S-PQCC-N32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
32
|
32
|
| Number of True Outputs |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCN
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Packing Method |
TUBE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
315 mA
|
|
| Propagation Delay (tpd) |
0.25 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.025 ns
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
5 mm
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Prop. Delay@Nom-Sup |
|
0.25 ns
|
|
|
|