NC7S08M5X
vs
MC74VHC1G08DTT3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
TSOP
|
| Package Description |
LSSOP,
|
TSOP, TSOP5/6,.11,37
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Family |
HC/UH
|
AHC/VHC
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2.9 mm
|
3 mm
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
125 ns
|
16.5 ns
|
| Seated Height-Max |
1.4 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.6 mm
|
1.5 mm
|
| Base Number Matches |
5
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Max I(ol) |
|
0.008 A
|
| Package Equivalence Code |
|
TSOP5/6,.11,37
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
11 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
|
|
|
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