NC7S08P5X vs 74HC1G08GW,125 feature comparison

NC7S08P5X Rochester Electronics LLC

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74HC1G08GW,125 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description TSSOP, PLASTIC, SC-88A, 5 PIN
Pin Count 5 5
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2 mm 2 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 125 ns 135 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 3 2
Manufacturer Package Code SOT353-1
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max I(ol) 0.002 A
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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