Findchips: Compare NC7SP17L6X vs 74LVC1G02GM,115

NC7SP17L6X vs 74LVC1G02GM,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	ROCHESTER ELECTRONICS INC	NXP SEMICONDUCTORS
Part Package Code	SON	SON
Package Description	VSON,	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Pin Count	6	6
Reach Compliance Code	unknown	compliant
Family	P	LVC/LCX/Z
JESD-30 Code	R-PDSO-N6	R-PDSO-N6
JESD-609 Code	e4	e3
Length	1.45 mm	1.45 mm
Logic IC Type	BUFFER	NOR GATE
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Inputs	1	2
Number of Terminals	6	6
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	VSON	VSON
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	46.3 ns	10.5 ns
Seated Height-Max	0.55 mm	0.5 mm
Supply Voltage-Max (Vsup)	3.6 V	5.5 V
Supply Voltage-Min (Vsup)	0.9 V	1.65 V
Supply Voltage-Nom (Vsup)	1.1 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	NICKEL GOLD	Tin (Sn)
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1 mm	1 mm
Base Number Matches	3	2
Manufacturer Package Code		SOT886
HTS Code		8542.39.00.01
Factory Lead Time		4 Weeks
Load Capacitance (CL)		50 pF
Max I(ol)		0.024 A
Package Equivalence Code		SOLCC6,.04,20
Packing Method		TR
Prop. Delay@Nom-Sup		6 ns
Qualification Status		Not Qualified
Schmitt Trigger		NO
	Logic » Gates	Logic » Gates