NCP2993FCT2G
vs
TPA0211DGNR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ONSEMI
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
WLCSP9, 1.22X1.22
|
MSOP
|
Package Description |
CSP-9
|
GREEN, PLASTIC, MSOP-8
|
Pin Count |
9
|
8
|
Manufacturer Package Code |
499BM
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
Texas Instruments
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
JESD-30 Code |
S-PBGA-B9
|
S-PDSO-G8
|
Length |
1.22 mm
|
3 mm
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.3 W
|
2 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HTSSOP
|
Package Equivalence Code |
BGA9,3X3,16
|
TSSOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.66 mm
|
1.1 mm
|
Supply Current-Max |
3.5 mA
|
6 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
1.22 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Gain |
|
2.5 dB
|
Harmonic Distortion |
|
1%
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Noise Figure-Nom |
|
93 dB
|
Peak Reflow Temperature (Cel) |
|
260
|
Technology |
|
CMOS
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD SILVER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare NCP2993FCT2G with alternatives
Compare TPA0211DGNR with alternatives