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NDT452AP vs BSP250,115 feature comparison

NDT452AP National Semiconductor Corporation

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BSP250,115 NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.21.00.75
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 30 V 30 V
Drain Current-Max (ID) 5 A 3 A
Drain-source On Resistance-Max 0.065 Ω 0.4 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-261
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 4 4
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type P-CHANNEL P-CHANNEL
Power Dissipation Ambient-Max 1.1 W 5 W
Power Dissipation-Max (Abs) 3 W 1.65 W
Pulsed Drain Current-Max (IDM) 15 A 12 A
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb) TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Turn-off Time-Max (toff) 90 ns 140 ns
Turn-on Time-Max (ton) 50 ns 80 ns
Base Number Matches 5 2
Part Package Code SC-73
Package Description PLASTIC, SMD, SC-73, 4 PIN
Pin Count 4
Manufacturer Package Code SOT223
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Transistors » Power Field-Effect Transistors
Transistors » Power Field-Effect Transistors

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