NE5532
vs
KA5532
feature comparison
Source Content uid |
NE5532
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP8,.3
|
DIP, DIP8,.3
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
0.8 µA
|
0.8 µA
|
Bias Current-Max (IIB) @25C |
0.8 µA
|
0.8 µA
|
Common-mode Reject Ratio-Nom |
100 dB
|
100 dB
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
4000 µV
|
4000 µV
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
JESD-609 Code |
e0
|
|
Length |
9.2 mm
|
9.2 mm
|
Low-Offset |
NO
|
NO
|
Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supplies |
+-15 V
|
+-15 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Slew Rate-Min |
6 V/us
|
6 V/us
|
Slew Rate-Nom |
8 V/us
|
9 V/us
|
Supply Current-Max |
16 mA
|
16 mA
|
Supply Voltage Limit-Max |
22 V
|
22 V
|
Supply Voltage-Nom (Vsup) |
15 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
10000
|
10000
|
Voltage Gain-Min |
2000
|
2000
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
2
|
|
|
|