NE5532AN
vs
TLE2024CDW
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
PLASTIC, DIP-8
|
GREEN, PLASTIC, SOIC-16
|
| Pin Count |
8
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
1 µA
|
0.09 µA
|
| Common-mode Reject Ratio-Nom |
100 dB
|
102 dB
|
| Input Offset Voltage-Max |
5000 µV
|
1200 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
9.78 mm
|
10.3 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Neg Supply Voltage Limit-Max |
-22 V
|
-20 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
4.45 mm
|
2.65 mm
|
| Slew Rate-Nom |
9 V/us
|
0.7 V/us
|
| Supply Voltage Limit-Max |
22 V
|
20 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
10000
|
2800
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
4
|
2
|
| Rohs Code |
|
Yes
|
|
|
|
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