NE5534AN vs SE5534AFK feature comparison

NE5534AN NXP Semiconductors

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SE5534AFK Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP14,.3 HQCCN,
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer NXP
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 2 µA 1.5 µA
Bias Current-Max (IIB) @25C 2 µA
Common-mode Reject Ratio-Nom 100 dB 100 dB
Frequency Compensation YES (AVCL>=3)
Input Offset Voltage-Max 5000 µV 3000 µV
JESD-30 Code R-PDIP-T8 S-CQCC-N20
JESD-609 Code e0
Low-Offset NO
Neg Supply Voltage Limit-Max -22 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 20
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP HQCCN
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER, HEAT SINK/SLUG
Qualification Status Not Qualified
Slew Rate-Nom 13 V/us 13 V/us
Supply Current-Max 10 mA
Supply Voltage Limit-Max 22 V 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Unity Gain BW-Nom 10000 10000
Voltage Gain-Min 15000
Base Number Matches 1 2
Length 8.89 mm
Seated Height-Max 2.03 mm
Width 8.89 mm

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