NE5534FE vs SE5534FE feature comparison

NE5534FE Philips Semiconductors

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SE5534FE NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP8,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 1.5 µA
Frequency Compensation YES (AVCL>=3)
Input Offset Voltage-Max 5000 µV 3000 µV
JESD-30 Code R-XDIP-T8 R-GDIP-T8
JESD-609 Code e0
Low-Offset NO
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 10 mA 9 mA
Supply Voltage Limit-Max 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Min 15000
Base Number Matches 3 2
Part Package Code DIP
Pin Count 8
Average Bias Current-Max (IIB) 1.5 µA
Common-mode Reject Ratio-Nom 100 dB
Length 9.955 mm
Seated Height-Max 5.08 mm
Slew Rate-Nom 13 V/us
Unity Gain BW-Nom 10000
Width 7.62 mm

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