NE555F
vs
TS556CD
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP14,.3
|
MICRO, PLASTIC, SO-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
PULSE; RECTANGULAR
|
PULSE; RECTANGULAR
|
| JESD-30 Code |
R-CDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
e4
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP14,.3
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
15 mA
|
|
| Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
1
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Additional Feature |
|
IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY
|
| Length |
|
8.65 mm
|
| Moisture Sensitivity Level |
|
1
|
| Output Frequency-Max |
|
2 MHz
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
3.9 mm
|
|
|
|
Compare NE555F with alternatives
Compare TS556CD with alternatives