NE555J vs UPD5555C feature comparison

NE555J STMicroelectronics

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UPD5555C Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS RENESAS ELECTRONICS CORP
Part Package Code DIP
Package Description DIP, DIP8,.3 0.300 INCH, PLASTIC, DIP-8
Pin Count 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE; RECTANGULAR
JESD-30 Code R-GDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Output Frequency-Max 0.5 MHz 0.5 MHz
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max (Isup) 15 mA
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 15 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Seated Height-Max 5.08 mm
Width 7.62 mm

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