NE555N
vs
MC1455BDR2
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SIGNETICS CORP
|
ON SEMICONDUCTOR
|
Package Description |
DIP-8
|
SOP, SOP8,.25
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
PULSE; RECTANGULAR
|
TIMER
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
e0
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Frequency-Max |
0.5 MHz
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
10
|
3
|
Pbfree Code |
|
No
|
Part Package Code |
|
SOIC-8 Narrow Body
|
Pin Count |
|
8
|
Manufacturer Package Code |
|
751-07
|
Samacsys Manufacturer |
|
onsemi
|
Length |
|
4.9 mm
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
235
|
Seated Height-Max |
|
1.75 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
3.9 mm
|
|
|
|
Compare NE555N with alternatives
Compare MC1455BDR2 with alternatives