NE556D vs TLC556MDREP feature comparison

NE556D Freescale Semiconductor

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TLC556MDREP Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS TEXAS INSTRUMENTS INC
Package Description SOP, SOP14,.25 SOP,
Reach Compliance Code unknown unknown
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supplies 5/15 V
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 10 1
Part Package Code SOIC
Pin Count 14
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE AT 15V NOMINAL
Analog IC - Other Type PULSE; RECTANGULAR
Length 8.65 mm
Number of Functions 2
Output Frequency-Max 1.2 MHz
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Width 3.9 mm

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