NL7SZ97DFT2G
vs
74LVC1G57GW
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SC-88/SC70-6/SOT-363 6 LEAD
|
|
| Package Description |
SC-70-6, SC-88, SOT-363, 6 PIN
|
|
| Pin Count |
6
|
|
| Manufacturer Package Code |
419B-02
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
58 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
674
|
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
LOGIC CIRCUIT
|
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
7
|
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP6,.08
|
TSSOP6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
6.3 ns
|
7.9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
YES
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
2.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
1.25 mm
|
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
|
|
|
Compare NL7SZ97DFT2G with alternatives