NL7SZ98DFT2G
vs
74LVC1G57GW,125
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
NXP SEMICONDUCTORS
|
Part Package Code |
SC-88/SC70-6/SOT-363 6 LEAD
|
TSSOP
|
Package Description |
SOT-363, 6 PIN
|
PLASTIC, SOT-363, SC-88, 6 PIN
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
419B-02
|
SOT363
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
JESD-609 Code |
e3
|
e3
|
Logic IC Type |
MAJORITY LOGIC GATE
|
LOGIC CIRCUIT
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Family |
|
LVC/LCX/Z
|
JESD-30 Code |
|
R-PDSO-G6
|
Length |
|
2 mm
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.024 A
|
Number of Functions |
|
1
|
Number of Terminals |
|
6
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Equivalence Code |
|
TSSOP6,.08
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
7.9 ns
|
Schmitt Trigger |
|
YES
|
Seated Height-Max |
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Width |
|
1.25 mm
|
|
|
|
Compare NL7SZ98DFT2G with alternatives
Compare 74LVC1G57GW,125 with alternatives