NPIC6C595BQ-Q100,1
vs
935297268115
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
| Part Package Code |
QFN
|
|
| Package Description |
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16
|
HVQCCN,
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT763-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2017-02-01
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Count Direction |
RIGHT
|
RIGHT
|
| Family |
NPIC
|
NPIC
|
| JESD-30 Code |
R-PQCC-N16
|
R-PQCC-N16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3.5 mm
|
3.5 mm
|
| Logic IC Type |
SERIAL IN PARALLEL OUT
|
SERIAL IN PARALLEL OUT
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
2.5 mm
|
2.5 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
|
|
|