NTS0104GU12,115
vs
NTS0104BQ,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
1.70 X 2 MM, 0.50 MM HEIGHT, PLASTIC, MO-288, SOT1174-1, QFN-12
|
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, VQFN-14
|
| Pin Count |
12
|
14
|
| Manufacturer Package Code |
SOT1174-1
|
SOT762-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
13 Weeks
|
13 Weeks
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| JESD-30 Code |
R-PQCC-N12
|
R-PQCC-N14
|
| Length |
2 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
12
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.5 mm
|
1 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.7 mm
|
2.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare NTS0104GU12,115 with alternatives
Compare NTS0104BQ,115 with alternatives