NTS0104PW
vs
NTS0104BQ,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
QFN
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
|
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, VQFN-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| JESD-30 Code |
R-PDSO-G14
|
R-PQCC-N14
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
1 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
4.4 mm
|
2.5 mm
|
| Base Number Matches |
3
|
1
|
| Manufacturer Package Code |
|
SOT762-1
|
| Factory Lead Time |
|
13 Weeks
|
|
|
|
Compare NTS0104PW with alternatives