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NX3L1G384GM vs NX3L1G384GW,125 feature comparison

NX3L1G384GM NXP Semiconductors

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NX3L1G384GW,125 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON TSSOP
Package Description VSON, SOLCC6,.04,20 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Pin Count 6 5
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-N6 R-PDSO-G5
JESD-609 Code e3 e3
Length 1.45 mm 2.05 mm
Moisture Sensitivity Level 1 1
Normal Position NO NO
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 5
Off-state Isolation-Nom 90 dB 90 dB
On-state Resistance-Max (Ron) 1.7 Ω 1.7 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 4.3 V 4.3 V
Supply Voltage-Min (Vsup) 1.4 V 1.4 V
Supply Voltage-Nom (Vsup) 1.65 V 1.65 V
Surface Mount YES YES
Switch-off Time-Max 21 ns 21 ns
Switch-on Time-Max 48 ns 48 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.25 mm
Base Number Matches 5 1
Manufacturer Package Code SOT353
Factory Lead Time 2 Days
Signal Circuits » Multiplexers or Switches
Signal Circuits » Multiplexers or Switches

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