NX3L1G384GM vs TS5A3167DCKRE4 feature comparison

NX3L1G384GM NXP Semiconductors

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TS5A3167DCKRE4 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SON SOIC
Package Description VSON, SOLCC6,.04,20 TSSOP, TSSOP5/6,.08
Pin Count 6 5
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-N6 R-PDSO-G5
JESD-609 Code e3 e4
Length 1.45 mm 2 mm
Moisture Sensitivity Level 1 1
Normal Position NO NC
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 5
Off-state Isolation-Nom 90 dB 64 dB
On-state Resistance-Max (Ron) 1.7 Ω 3.4 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Equivalence Code SOLCC6,.04,20 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 4.3 V 5.5 V
Supply Voltage-Min (Vsup) 1.4 V 1.65 V
Supply Voltage-Nom (Vsup) 1.65 V 1.8 V
Surface Mount YES YES
Switch-off Time-Max 21 ns 17.5 ns
Switch-on Time-Max 48 ns 19 ns
Switching BREAK-BEFORE-MAKE MAKE-BEFORE-BREAK
Technology CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.25 mm
Base Number Matches 5 1

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Compare TS5A3167DCKRE4 with alternatives