NX5DV330BQ,115
vs
NX5DV330PW
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
HVQCCN,
|
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT763-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Family |
5DV
|
5DV
|
| JESD-30 Code |
R-PQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3.5 mm
|
5 mm
|
| Logic IC Type |
MULTIPLEXER AND DEMUX/DECODER
|
MULTIPLEXER AND DEMUX/DECODER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
1
|
1
|
| Number of Outputs |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4 V
|
4 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2.5 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
| Propagation Delay (tpd) |
|
6 ns
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare NX5DV330BQ,115 with alternatives
Compare NX5DV330PW with alternatives