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NX5DV330D,118 vs NX5DV330DS,112 feature comparison

NX5DV330D,118 NXP Semiconductors

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NX5DV330DS,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOP SSOP1
Package Description 3.90 MM, PLASTIC, MO-012, SOT109-1, SOP-16 3.90 MM, 0.635 MM PITCH, PLASTIC, SOT519-1, SSOP-16
Pin Count 16 16
Manufacturer Package Code SOT109-1 SOT519-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family 5DV 5DV
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 9.9 mm 4.9 mm
Logic IC Type MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 1 1
Number of Outputs 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 6 ns 6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.73 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4 V 4 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Samacsys Manufacturer NXP
Packing Method BULK
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

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