OMAPL138EZCE4
vs
OMAPL138EZCEA3
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
NFBGA-361
|
| Pin Count |
361
|
361
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Additional Feature |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
|
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
|
| Address Bus Width |
23
|
23
|
| Barrel Shifter |
NO
|
NO
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B361
|
S-PBGA-B361
|
| JESD-609 Code |
e1
|
e1
|
| Length |
13 mm
|
13 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
64
|
64
|
| Number of Serial I/Os |
3
|
3
|
| Number of Terminals |
361
|
361
|
| Number of Timers |
4
|
4
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
90 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA361,19X19,25
|
BGA361,19X19,25
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (words) |
499712
|
499712
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.3 mm
|
1.3 mm
|
| Supply Voltage-Max |
1.35 V
|
1.35 V
|
| Supply Voltage-Min |
1.25 V
|
1.25 V
|
| Supply Voltage-Nom |
1.3 V
|
1.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
13 mm
|
13 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
3
|
|
|
|
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