OP297GBC
vs
OP297GSZ-REEL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
DIE
|
SOIC
|
| Package Description |
1.80 X 2.90 MM, DIE-8
|
LEAD FREE, MS-012AA, SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0002 µA
|
0.00075 µA
|
| Common-mode Reject Ratio-Min |
114 dB
|
114 dB
|
| Input Offset Voltage-Max |
200 µV
|
400 µV
|
| JESD-30 Code |
R-XUUC-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Neg Supply Voltage Limit-Max |
-20 V
|
-20 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Nom |
0.15 V/us
|
0.15 V/us
|
| Supply Current-Max |
1.25 mA
|
1.5 mA
|
| Supply Voltage Limit-Max |
20 V
|
20 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Unity Gain BW-Nom |
500
|
500
|
| Voltage Gain-Min |
1200000
|
1200000
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
R-8
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.0002 µA
|
| Common-mode Reject Ratio-Nom |
|
130 dB
|
| Frequency Compensation |
|
YES
|
| Length |
|
4.9 mm
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
YES
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOP8,.25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Slew Rate-Min |
|
0.05 V/us
|
| Technology |
|
BIPOLAR
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3.9 mm
|
|
|
|
Compare OP297GBC with alternatives
Compare OP297GSZ-REEL with alternatives