OR2C08A4J160-DB
vs
OR2C08A3J160I-DB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP-160
|
QFP-160
|
Pin Count |
160
|
160
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
MAXIMUM USABLE GATES 21600
|
MAXIMUM USABLE GATES 21600
|
Combinatorial Delay of a CLB-Max |
2.2 ns
|
2.9 ns
|
JESD-30 Code |
S-PQFP-G160
|
S-PQFP-G160
|
JESD-609 Code |
e0
|
e0
|
Length |
28 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
196
|
196
|
Number of Equivalent Gates |
9400
|
9400
|
Number of Inputs |
130
|
130
|
Number of Logic Cells |
784
|
784
|
Number of Outputs |
130
|
130
|
Number of Terminals |
160
|
160
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
196 CLBS, 9400 GATES
|
196 CLBS, 9400 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP160,1.2SQ
|
QFP160,1.2SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.07 mm
|
4.07 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
28 mm
|
28 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare OR2C08A4J160-DB with alternatives
Compare OR2C08A3J160I-DB with alternatives