OR2C08A4J160-DB vs OR2C08A3J160I-DB feature comparison

OR2C08A4J160-DB Lattice Semiconductor Corporation

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OR2C08A3J160I-DB Lattice Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code QFP QFP
Package Description QFP-160 QFP-160
Pin Count 160 160
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES 21600 MAXIMUM USABLE GATES 21600
Combinatorial Delay of a CLB-Max 2.2 ns 2.9 ns
JESD-30 Code S-PQFP-G160 S-PQFP-G160
JESD-609 Code e0 e0
Length 28 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 196 196
Number of Equivalent Gates 9400 9400
Number of Inputs 130 130
Number of Logic Cells 784 784
Number of Outputs 130 130
Number of Terminals 160 160
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 196 CLBS, 9400 GATES 196 CLBS, 9400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP160,1.2SQ QFP160,1.2SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.07 mm 4.07 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 28 mm 28 mm
Base Number Matches 2 2

Compare OR2C08A4J160-DB with alternatives

Compare OR2C08A3J160I-DB with alternatives