OR2T15B7BA256-DB vs OR2T15B7BA256I-DB feature comparison

OR2T15B7BA256-DB Lattice Semiconductor Corporation

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OR2T15B7BA256I-DB Lattice Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description PLASTIC, BGA-256 PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES 44200 MAXIMUM USABLE GATES 44200
Clock Frequency-Max 833 MHz 833 MHz
Combinatorial Delay of a CLB-Max 1.3 ns 1.3 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 27 mm 27 mm
Moisture Sensitivity Level 3
Number of CLBs 400 400
Number of Equivalent Gates 19200 19200
Number of Inputs 211 211
Number of Logic Cells 1600 1600
Number of Outputs 211 211
Number of Terminals 256 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 400 CLBS, 19200 GATES 400 CLBS, 19200 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,20X20,50 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.32 mm 2.32 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare OR2T15B7BA256-DB with alternatives

Compare OR2T15B7BA256I-DB with alternatives