OR2T15B7BA256-DB
vs
OR2T15B7BA256I-DB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-256
|
PLASTIC, BGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
MAXIMUM USABLE GATES 44200
|
MAXIMUM USABLE GATES 44200
|
Clock Frequency-Max |
833 MHz
|
833 MHz
|
Combinatorial Delay of a CLB-Max |
1.3 ns
|
1.3 ns
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
400
|
400
|
Number of Equivalent Gates |
19200
|
19200
|
Number of Inputs |
211
|
211
|
Number of Logic Cells |
1600
|
1600
|
Number of Outputs |
211
|
211
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
400 CLBS, 19200 GATES
|
400 CLBS, 19200 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,20X20,50
|
BGA256,20X20,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.32 mm
|
2.32 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare OR2T15B7BA256-DB with alternatives
Compare OR2T15B7BA256I-DB with alternatives