OR3L165B7BA352-DB
vs
OR4E04-2BA352I
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-352
|
PLASTIC, BGA-352
|
Pin Count |
352
|
352
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
MAXIMUM USABLE GATES=244000
|
MAXIMUM NO OF USABLE GATES IS 643000
|
Combinatorial Delay of a CLB-Max |
1.03 ns
|
0.81 ns
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
1024
|
1296
|
Number of Equivalent Gates |
120000
|
333000
|
Number of Inputs |
286
|
262
|
Number of Logic Cells |
8192
|
10368
|
Number of Outputs |
286
|
262
|
Number of Terminals |
352
|
352
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1024 CLBS, 120000 GATES
|
1296 CLBS, 333000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA352,26X26,50
|
BGA352,26X26,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
2.54 mm
|
Supply Voltage-Max |
2.625 V
|
1.575 V
|
Supply Voltage-Min |
2.375 V
|
1.425 V
|
Supply Voltage-Nom |
2.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Clock Frequency-Max |
|
420 MHz
|
|
|
|
Compare OR3L165B7BA352-DB with alternatives
Compare OR4E04-2BA352I with alternatives