OR3L165B7BA352I-DB
vs
OR4E02-1BAN352C
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-352
|
BGA,
|
Pin Count |
352
|
352
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
MAXIMUM USABLE GATES=244000
|
MAXIMUM NO OF USABLE GATES IS 397000
|
Clock Frequency-Max |
266.4 MHz
|
420 MHz
|
Combinatorial Delay of a CLB-Max |
1.03 ns
|
1.1 ns
|
JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
1024
|
624
|
Number of Equivalent Gates |
120000
|
201000
|
Number of Inputs |
286
|
|
Number of Logic Cells |
8192
|
|
Number of Outputs |
286
|
|
Number of Terminals |
352
|
352
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1024 CLBS, 120000 GATES
|
624 CLBS, 201000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA352,26X26,50
|
BGA352,26X26,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.51 mm
|
2.54 mm
|
Supply Voltage-Max |
3.6 V
|
1.575 V
|
Supply Voltage-Min |
3 V
|
1.425 V
|
Supply Voltage-Nom |
3.3 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare OR3L165B7BA352I-DB with alternatives
Compare OR4E02-1BAN352C with alternatives