OR3L165B7BA352I-DB vs OR4E02-2BMN416C feature comparison

OR3L165B7BA352I-DB Lattice Semiconductor Corporation

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OR4E02-2BMN416C Lattice Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description PLASTIC, BGA-352 BGA,
Pin Count 352 416
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES=244000 MAXIMUM NO OF USABLE GATES IS 397000
Clock Frequency-Max 266.4 MHz 420 MHz
Combinatorial Delay of a CLB-Max 1.03 ns 0.81 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B416
Length 35 mm 27 mm
Moisture Sensitivity Level 3
Number of CLBs 1024 624
Number of Equivalent Gates 120000 201000
Number of Inputs 286
Number of Logic Cells 8192
Number of Outputs 286
Number of Terminals 352 416
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1024 CLBS, 120000 GATES 624 CLBS, 201000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA352,26X26,50 BGA416,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.51 mm 2.38 mm
Supply Voltage-Max 3.6 V 1.575 V
Supply Voltage-Min 3 V 1.425 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 27 mm
Base Number Matches 1 1

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Compare OR4E02-2BMN416C with alternatives