P80C32X2BBD
vs
TSC87C52-12IBR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TEMIC SEMICONDUCTORS
|
| Package Description |
QFP, QFP44,.47SQ,32
|
PLASTIC, LCC-44
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQCC-J44
|
| JESD-609 Code |
e3
|
e0
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Equivalence Code |
QFP44,.47SQ,32
|
LDCC44,.7SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
256
|
| Speed |
33 MHz
|
12 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
2
|
2
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
16
|
| Clock Frequency-Max |
|
12 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
8
|
| Number of I/O Lines |
|
32
|
| On Chip Program ROM Width |
|
8
|
| PWM Channels |
|
NO
|
| ROM (words) |
|
8192
|
| ROM Programmability |
|
OTPROM
|
| Supply Current-Max |
|
20 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
|
|
|