P80C32X2BBD vs TSC87C52-25IBB feature comparison

P80C32X2BBD NXP Semiconductors

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TSC87C52-25IBB Atmel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ATMEL CORP
Part Package Code QFP LCC
Package Description LQFP, QFP44,.47SQ,32 QCCJ, LDCC44,.7SQ
Pin Count 44 44
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz 25 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G44 S-PQCC-J44
JESD-609 Code e3 e0
Length 10 mm 16.55 mm
Moisture Sensitivity Level 1 2
Number of I/O Lines 32 32
Number of Terminals 44 44
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QCCJ
Package Equivalence Code QFP44,.47SQ,32 LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE CHIP CARRIER
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
Seated Height-Max 1.6 mm 4.57 mm
Speed 33 MHz 25 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 16.55 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
On Chip Program ROM Width 8
ROM (words) 8192
ROM Programmability OTPROM
Supply Current-Max 36.25 mA

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