P80C32X2BBD vs TSC87C52-25II feature comparison

P80C32X2BBD Philips Semiconductors

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TSC87C52-25II Temic Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS TEMIC SEMICONDUCTORS
Package Description QFP, QFP44,.47SQ,32
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Bit Size 8 8
CPU Family 8051
JESD-30 Code S-PQFP-G44 S-CQCC-J44
JESD-609 Code e3
Number of Terminals 44 44
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Equivalence Code QFP44,.47SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256
Speed 33 MHz 25 MHz
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm
Terminal Position QUAD QUAD
Base Number Matches 2 2
Has ADC NO
Address Bus Width 16
Clock Frequency-Max 25 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 8
Number of I/O Lines 32
PWM Channels NO
ROM Programmability OTPROM
Supply Current-Max 36.25 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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